SiP and More

Technology

Our expertise in RF circuit miniaturization and system-in-package (SiP) technology help us reach the goals of smaller size and greater functionality ever reached in the past and requested today by the market. With Insight SiP, it’s all in the package. At Insight SiP our experts are fluent in all phases of the design cycle with SIP design knowledge combined with complete RF expertise: system design/partitioning, RF circuit design, physical layout & circuit design, system verification & multiple designs, layout check and tests. They have a solid understanding of:
- passive components (capacitors, inductor types….),
- passive circuit design (filters, BALUNs, matching, power dividers…),
- active circuit design (LNA, PA, mixer, switch…)
- RF architecture
- as well as package types, package assembly and process flows. Our designers have the capabilities to evaluate architectural trade-offs,  substrate technology alternatives (laminate, LTCC & IPD) and assembly related options (SMT, BGA, Wire-bond, Flip chip, Embedded die,…) to propose a set of optimized solutions to meet customer’s constraints. They have unique methods to estimate package size and performance for each of these options.

We have the know-how to design ultra-thin SiP. Progress in SiP module thickness reduction is necessary for future ultra-slim cell phones and PDAs and to enable integration of RF modules within the SiM card.

Antenna-in-Package (AiP) solutions

Insight SiP is leading system miniaturization where the antenna is no longer a separate component within the wireless device but is integrated in the package, thus the concept of antenna-in-package or AiP.
Today in each mobile device there are numerous communication modules and it is understandable that the integration of the antenna into the module brings a huge advantage in terms of cost and performance. Insight SiP has designed RF SiPs over the past few years, based on various substrate technologies such as LTCC, laminate or IPD. This has lead to SiP solutions which also integrate the antenna - called AiP (Antenna In Package).

Modules

Insight SiP proposes ready-to-use RF modules to module manufacturers and ODMs.
They are the optimal solutions for designers looking to add wireless connectivity to a product without a complex and time consuming development cycle.
These modules can be personalized to meet customer specific requirements and technical constraints.

SIP Manufacturing

Insight SiP is your System-in-Package partner and takes care of all aspects of custom SiP from specification and feasibility through to logistic support of full scale production at selected partner manufacturing sites.
Key benefits of Insight SiP production management:
-    Enables customers to focus on core competencies
-    Focuses on reducing cost while improving performance
-    Provides a one stop shop for custom system-in-package products

Insight SiP capabilities:
-    Supply chain coordination during manufacturing
-    Management of production test, qualification and certification

Download INSIGHT-SIP presentation.pdf