The increased demand for wireless connectivity in portable electronic devices has driven manufacturers to deliver ever-smaller, more cost effective solutions. This makes the integration of RF into a single product more and more complex and increases technical risk while in the mean time the product development cycle has to be reduced.
At Insight-SiP we rapidly solve these challenges. Based on a system-in-package approach we make complex RF systems easy to integrate in any existing or future portable application. We contribute to reduce our customer’s product development cycle and accelerate their product’s release-to-market.
It’s all in the package! In less time!
Insight SiP serves the market with turn-key design services and creative packaging solutions to customers who need highly integrated systems to meet wireless and portable devices space requirements.
Experts in custom multi-die RF circuit miniaturization, System-in-Package (SiP) and Antenna-in-Package (AiP) designs, Insight SiP also provides ready-to-use RF modules for Bluetooth Low Energy applications such as telecom and mobile computing, portable consumer devices, healthcare, automotive – connected cars, industrial, Internet-of-Things (IoT).
Discover more on what Insight SiP delivered to address the following market segments:
- Telecom and Mobile Phones
- Portable Consumer Devices
- Automotive – Connected Cars
- Internet-of-Things (IoT)
Insight SiP has designed a series of ultra-miniature wireless modules for various applications such as 3G, 4G/LTE, 60Ghz, ANT, Antenna Tuning, Bluetooth Smart, Bluetooth, GSM/W-CDMA, GPS/Glonass, ISM, NFC, RFID, Wireless Sensor Modules, Software Define Radio, Transfer Jet, Ultra-miniature Antennas, UMTS, UWB, WHDI, Wifi, WLAN, Zigbee …
Insight SiP has a diverse client base which includes tier one OEM’s, leading chipset vendors and hi-tech innovative startup companies.