Bluetooth Low Energy 5 Ready - ISP1507 High Performance Combo Module

High Performance Bluetooth / ANT+ NFC / Low Energy Module with MCU and Antenna

At 8x8x1 mm, we believe this is the smallest Bluetooth Low Energy module on the market.
At 8x8x1 mm, we believe this is the smallest Bluetooth Low Energy module on the market.

Features | Applications | Block Diagram | Main Specifications | Product User Guide |Dev Zone


This miniature BLE module by InsightSIP, based on the latest nRF52 chip from Nordic Semiconductor represents the state of the art in Bluetooth Module Technology. At 8x8x1 mm, we believe this is the smallest fully integrated Bluetooth Low Energy module on the market. It offers a full Bluetooth 5 Ready stack and IPv6 connectivity, and thus can form the hub of IOT (Internet of Things) solutions.

With an M4 floating point processor, the ISP1507 Bluetooth Smart Module is able to do fast calculations, and run advanced security and cryptography calculations, and with a large memory capacity, is able to support sophisticated applications. In many cases, this module can eliminate the need for an additional microprocessor and/or additional memory that might have been necessary for previous generation products, saving cost of the total solution.

This increased computing capability comes coupled with best-in-class battery life, with power consumption around 20-50% lower than previous generations of technology, (depending on the exact use-case), making this Bluetooth Low Energy / BLE module without compromise.

The addition of integrated NFC touch-to-pair capability adds a further feature that would have previously required additional components.

With its tiny size, high performance and wide feature set, the ISP1507 BLE Module truly represents a case where “less is more”. It is the ideal choice where solutions require complex applications, fast processing and/or best in class power consumption.


  • Connected sensors for medical devices, healthcare, sport, fitness, industrial …
  • IoT applications, connected objects
  • Wearable technology
  • Home automation
  • Beacons

Block Diagram

This module is based on nRF52 Nordic Semiconductor System on Chip (SoC). It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols. An NFC Tag is available for OOB pairing. Free qualified BLE stacks for nRF52832 are implemented in the S132 SoftDevices and enable ISP1507 to be used in Central, Peripheral or both roles. nRF52832 platform also provides extensive software support for ANT applications with S212 SoftDevices and dual ANT/BLE S332 stack.

Main Specifications

  • Single Mode BLE 5 Ready
  • ANT/ANT+ stack available
  • NFC-A Tag for OOB pairing
  • Based on Nordic Semiconductor nRF52
  • 2.4GHz low energy RF Transceiver
  • 32-bit ARM Cortex M4 CPU
  • 512 kB Flash & 64 kB SRAM
  • 30 GPIOs including ADC, SPI, UART, PDM, I2C
  • Ultra small size 8.0 x 8.0 x 1.0 mm
  • Fully integrated RF matching and Antenna
  • Integrated 32 MHz & 32kHZ Clock
  • DC/DC converter with loading circuit

  • Operating Conditions
    • Supply voltage 1.7 to 3.6 V
    • Temperature range -40 to +85°C
  • Power Consumption
    • Peak current, Rx active 6.1 mA
    • Peak current, Tx active 5.4 mA
    • Deep sleep current 0.4 µA
  • Clock Sources
    • Internal HF clock, 32 MHz crystal
    • Internal LF clock, 32.768 kHz crystal
    • Frequency tolerance +/- 40 ppm
  • Radio Specification
    • Frequency range 2402-2480 MHz
    • Rx sensitivity -96 dBm
    • Antenna gain 0.6 dBi
    • Range open field 100 m typ
    • Data rate up to 2 Mbps

Product User Guide

  • Ordering Information
    • ISP1507-AX-ZZ
      BLE & ANT protocol, 512 kB flash, 64 kB RAM
  • Prototype Packaging (ZZ = ST)
    • Delivered in unsealed standard trays or cut tapes
    • Please bake the module before assembly
  • Jedec Trays (ZZ = JT)
    • Delivered in sealed packaging
  • Tape & Reels
    • Delivered in sealed packaging
    • Multiple of 500 units (ZZ = RS)
    • Multiple of 2000 units (ZZ = R2)

  • Storage
    • Electronic sensitive devices
  • Moisture Sensitivity
    • Level MSL-5
    • Bake 24 hours at 125°C if module stored at ambient room
  • Soldering Information
    • According to Jedec J-STD-020
    • Maximum peak temperature
      260°C / 30 sec


Insight SiP
GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Phone: +33 (0) 493 008 880



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