Product samples available from stock.
For more quantity, please consult us.
All shipments are Ex Works. Shipment service provided if needed.
Delivered in standard tray from 15 to 99 units. These parts are MSL Level 5 and must be baked before assembly.
Delivery in Jedec tray with sealed pack, desiccant and humidity sensor for multiple of 100 units.
This tiny LGA module, 8 x 11 x 1.2 mm, is based on the nRF51 series Chip. Its powerful Cortex™ M0 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. All chip digital and analogue interfaces are available and give optimum capabilities for sensor integration.