Insight SiP optimizes the technology choices to meet customer requirements in terms of size, cost and time-to-market.
The design & manufacturing of highly integrated RF systems and sub-systems proposed by Insight SiP is based on:
- System in package approach
- Ability to integrate any technology: PCB, LTCC, Thin film, Thick film…
- Major semiconductor manufacturers
Insight SiP has access to world leaders design rules for each SiP manufacturing technology and packaging, allowing us to select the most effective combination of process and production partner for each project we are working on:
- Design Houses
Just to name few of them:
Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 300 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 6 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.
For further information, visit www.amkor.com
Established in May 1984, Siliconware Precision Industries Co., Ltd. has become one of the leading providers of comprehensive semiconductor assembly and test services. PIL is dedicated to meeting all customer's integrated circuit packaging and testing requirements. Our turnkey solutions range from bumping, wafer sort, assembly, final test, to shipment. Products include advanced leadframe and substrate based packages, which are widely used in, but not limited to, computers, tablets, cellular phones, set-top boxes, LCD monitors, wearable devices, smart appliances, digital cameras and video game consoles
For further information, visit www.spil.com
Teledyne e2v Grenoble provides state-of-the-art Assembly & Test services to customers seeking high-end packaging technologies. Our turnkey solutions encompass Hi Rel low & medium volume manufacturing for microprocessors, FPGAs, ASICs, data converters, Image Sensors & more. Package types range from wire bond to flip chip, BGA, SiP, MCM.
For further information, visit www.e2v.com
Tong Hsing Electronics
Tong Hsing is a provider of state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
For further information, visit theil.com
Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization.
For further information, visit www.unisemgroup.com
Subtron Technology Co., Ltd. manufactures and sells IC boards in Taiwan. Its products include RF, CSP, PBGA, MEMS, etc., as well as TAB, COF, INK, and LED products. The company was founded in 1998 and is based in Hukou, Taiwan.
For further information, visit www.subtron.com.tw
Unimicron develops innovative PCB and IC carrier new products with superior quality and competible cost using cutting-edge technology to meet the needs of each customer in the future.
For further information, visit www.unimicron.com
Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future.
For further information, visit www.infineon.com
The unique IPD technology developed by IPDiA is a highly efficient way of integrating tens or even hundreds of passive components. Moreover, the performances resulting from this technology exceed those obtained with traditional SMDs. The size of application boards could easily be reduced by a factor of more than 10 to create unprecedented innovative products. In addition, greater reliability and significant cost reductions can be achieved by replacing external SMD components by customized IPD dies.
For further information, visit www.ipdia.com
STMicroelectronics is a world leader in providing the semiconductor solutions that make a positive contribution to people’s lives, today and into the future. Offering one of the industry’s broadest product portfolios, ST serves customers across the spectrum of electronics applications with innovative semiconductor solutions for Smart Driving and the Internet of Things.
For further information, visit www.st.co
DT Microcircuits Corporation, a part of Darfon Electronics, is a Taiwanese company engaged in the research, development, manufacture and marketing of components and parts of computer peripheral products, integrated and telecommunication components, as well as power devices.
For further information, visit www.darfon.com
KYOCERA Fineceramics Group, headed by KYOCERA Fineceramics GmbH (Esslingen, Germany), provides a broad range of electronic packaging solutions for the semiconductor and telecommunication markets based on ceramic, metal and organic material technologies. Taiwanese company engaged in the research, development, manufacture and marketing of components and parts of computer peripheral products, integrated and telecommunication components, as well as power devices.
For further information, visit www.kyocera.eu
EnSilica was founded in 2001 and has a strong track record of success in delivering ASIC and FPGA based solutions to semiconductor companies and OEMs worldwide. The company is headquartered in the UK and has subsidiaries in India and the USA. The company is a specialist in low-power ASIC design and complex FPGA-based embedded systems. In addition to supplying IP and turnkey ASIC/FPGA development and supply, EnSilica also provides point services to companies with in-house ASIC design teams. These services include system engineering, analogue and mixed signal design, and advanced verification using UVM, DFT and physical implementation.
For further information, visit www.ensilica.com