EDAPS 2008

Date : 2008-12-10 - Seoul - Korea
Enhanced Wire Bond transition from Die to Chip carrier for 3.1-10.6 GHz UWB applications
by Olivier Fourquin - Insight SiP & Joseph Romen Cubillo, Pr Jean Gaubert, Dr Sylvain Bourdel, Marc.Battista - IM2NP
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IMAPS 2008

Date : 2008-11-02 - Providence - USA
RF System in Package Design for Portability between Suppliers and Technology Platforms
by Chris Barratt - Insight SiP
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SAME 2008

Date : 2008-10-01 - Sophia Antipolis - France
RF System in Package Design for Portability between suppliers and technology platforms
by Chris Barratt - Insight SiP
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GDR SiP 2008

Date : 2008-06-04 - Paris - France
Design method for high frequency carrier to die transition in UWB SiP
by Olivier Fourquin - Insight SiP & Joseph Romen Cubillo, Pr Jean Gaubert, Dr Sylvain Bourdel, Marc Battista, Dr Nicolas Dehaese - IM2NP
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