Technology Partners

Teledyne e2v

Teledyne e2v Grenoble provides state-of-the-art Assembly & Test services to customers seeking high-end packaging technologies. Our turnkey solutions encompass Hi Rel low & medium volume manufacturing for microprocessors, FPGAs, ASICs, data converters, Image Sensors & more. Package types range from wire bond to flip chip, BGA, SiP, MCM.
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Insight SiP
GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Phone: +33 (0) 493 008 880

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