Beckermus is the leading micro assembly services provider in Israel, supplying microelectronics and micro-optics/photonics assembly services worldwide. Our company has more than 20 years of experience in manual and automated bare-die packaging. Working closely with startups and R&D teams we do not ask for a minimum size order. We provide assembly for even a single prototype and up to mid-high-volume production. Our main services are: active alignment, micro-optics assembly, wire bonding, die attach, wafer level packaging, flip chip, 3D stacked dies and more.  For further information, visit www.Beckermus.com