Teledyne e2v Grenoble provides state-of-the-art Assembly & Test services to customers seeking high-end packaging technologies. Our turnkey solutions encompass Hi Rel low & medium volume manufacturing for microprocessors, FPGAs, ASICs, data converters, Image Sensors & more. Package types range from wire bond to flip chip, BGA, SiP, MCM.
For further information, visit www.e2v.com