Technology Partners


Beckermus is the leading micro assembly services provider in Israel, supplying microelectronics and micro-optics/photonics assembly services worldwide. Our company has more than 20 years of experience in manual and automated bare-die packaging. Working closely with startups and R&D teams we do not ask for a minimum size order. We provide assembly for even a single prototype and up to mid-high-volume production. Our main services are: active alignment, micro-optics assembly, wire bonding, die attach, wafer level packaging, flip chip, 3D stacked dies and more.  For further information, visit

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Insight SiP
GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Phone: +33 (0) 493 008 880

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