ASE

ASE is a primary architect of Heterogeneous Integration (HI) - the technology that integrates separately manufactured components into a higher level assembly (System-in-Package or SiP) that in the aggregate provides enhanced functionality and improved operational characteristics. We are also involved in many stages of the semiconductor manufacturing process - front-end engineering test, wafer probing, IC package design, substrate design and manufacturing, IC packaging (assembly), final test as well as module, board assembly and test in collaboration with our sister company, USI. For further information, visit ASE (aseglobal.com)