Technology Partners
Insight SiP optimizes the technology choices to meet customer requirements in terms of size, cost and time-to-market.
The design & manufacturing of highly integrated RF
systems and sub-systems proposed by Insight SiP is based
on:
- System in package approach
- Ability to integrate any technology: PCB, LTCC, Thin
film, Thick film…
- Major semiconductor manufacturers
Insight SiP has access to world leaders design rules for
each SiP manufacturing technology and packaging, allowing
us to select the most effective combination of process
and production partner for each project we are working
on:
- Assembly
- Laminate
- IPD
- LTCC
Just to name few of them:
Assembly |
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Laminate |
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Kinsus
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IPD |
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STMicroelectronics
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LTCC |
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