Technology Partners

Insight SiP optimizes the technology choices to meet customer requirements in terms of size, cost and time-to-market.

The design & manufacturing of highly integrated RF systems and sub-systems proposed by Insight SiP is based on:
‐ System in package approach
- Ability to integrate any technology: PCB, LTCC, Thin film, Thick film…
‐ Major semiconductor manufacturers

Insight SiP has access to world leaders design rules for each SiP manufacturing technology and packaging, allowing us to select the most effective combination of process and production partner for each project we are working on:
‐ Assembly
‐ Laminate
‐ IPD
‐ LTCC

Just to name few of them:

Assembly
Laminate
	Kinsus
IPD
	STMicroelectronics
LTCC

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