Technology
Our expertise in RF circuit miniaturization and
system-in-package (SiP) technology help us reach
the goals of smaller size and greater functionality ever
reached in the past and requested today by the market.
With Insight SiP, it’s all in the
package.
At Insight SiP our experts are
fluent in all phases of the design cycle with SIP
design knowledge combined with complete RF
expertise: system design/partitioning, RF circuit
design, physical layout & circuit design, system
verification & multiple designs, layout check and
tests.
They have a solid understanding of:
- passive components (capacitors, inductor
types….),
- passive circuit design (filters, BALUNs, matching, power
dividers…),
- active circuit design (LNA, PA, mixer,
switch…)
- RF architecture
- as well as package types, package assembly and process
flows.
Our designers have the capabilities to evaluate
architectural trade-offs, substrate technology
alternatives (laminate, LTCC & IPD) and assembly
related options (SMT, BGA, Wire-bond, Flip chip, Embedded
die,…) to propose a set of optimized solutions to
meet customer’s constraints. They have unique methods
to estimate package size and performance for each of these
options.
We have the know-how to design ultra-thin SiP. Progress in SiP module thickness reduction is necessary for future ultra-slim cell phones and PDAs and to enable integration of RF modules within the SiM card.
We provide:
-
Design Service
Design methodology
Custom multi-chip RF system-in-package (SiP) design
Antenna-in-package (AiP) design
Manufacturing management
-
Ready-to-use RF modules to module manufacturers and
ODMs
The optimal solutions for designers looking to add wireless
connectivity to a product without a complex and time
consuming development cycle.
Insight SiP is a research center approved by the
French Ministry of Education and Research.
Under some conditions French companies using our services
can get the benefit of a research tax credit (crédit
d’impôt recherche - CIR).
Documentation from French Ministry of
Education and Research
