Technical information

The following case studies and white papers demonstrate you how we master RF technology and miniaturization design.

Case Studies

‐    WiFi Module
The design team has been asked to include WiFi capability in portable devices meeting size, power consumption and cost constraints.
Key design challenges addressed at the SiP level are:
‐    Embedding high-performance RF functions in the LTCC substrate
‐    High-density interconnect of base-band die and digital functions
‐    Coupling mitigation between RF signals and noisy digital and power supply signals.

‐    Quad Band GSM integrated antenna
The objective is to miniaturize a PCB board developed for M2M applications and integrate a GSM antenna. The design team had the task to find a replacement of an existing chip antenna that did not meet the performance requirements and added cost to the total solution.
Discover how we overcome the antenna in package design challenge.

‐    Half-mini PCI Card
The goal is to miniaturize an existing PCI Express Card and make it fit in a half-mini card form factor, sized 26.8mm x 30mm, fully functional.
This complex RF module has to support all cellular standards - HSPA, W-CDMA, EDGE and GSM - and to be integrated into portable consumer electronic devices that need mobile connectivity technology.

White papers

‐    Antenna in Package (AiP) design methodology
Insight SiP has designed RF SiPs over the past few years, based on various substrate technologies such as LTCC, laminate or IPD. This has lead to SiP solutions which also integrate the antenna - called AiP (Antenna In Package). SiP performance is maintained when the antenna is included in the package. This white paper describes our approach.

‐    Antenna in Package (AiP) examples
Two different examples of AiP based on our design methodology are presented:
‐    The first example uses a multilayer ceramic substrate,
‐    Whilst the second uses a 2 layer organic laminate substrate.

‐    RF System in Package Design for Portability between suppliers and technology platforms
The novel design methodology that is presented in this paper is aimed at allowing easy transfer of integrated passive circuit design from one supplier to another and even from one technology to another (e.g. LTCC to IPD).
The paper illustrates the design method with some examples of RF SiP designs that have been ported between LTCC suppliers and between LTCC and IPD technologies.