A new approach
to RF system-in-package (SiP) design

Advances in circuit ultra-miniaturization and System-in-Package (SiP) technology have made the goals of smaller size and greater functionality attainable. Insight SiP has developed methodologies that help solve the issue of portability while allowing for greater integration.
Download technical paper on RF SIP design for portability.

The methodology shows that SiPs scale and optimize well allowing for aggressive design schedules from system definition down to fully tested module.    

Click here to get more details about our design methodology

The increased demand of wireless connectivity integration in portable electronic devices has driven manufacturers to deliver ever-smaller, more cost effective solutions. This makes the integration of RF functionalities into a single product more and more complex and increases technical risk while in the same time the product development cycle has to be reduced. At Insight SiP we solve these challenges.

We propose a turn-key design services for highly integrated solutions in the system-in-package (SiP) arena. We contribute to reduce our customer’s product development cycle and accelerate their product release-to-market.

Design Services cycle

We work closely with our customers through all stages of the design process our key capabilities in an end-to-end design services for SiP are described below:

1. Feasibility study
2. Detailed design process
3. System integration

Click here to get more details about our system-in-package design cycle

Why choose Insight SiP?

We deliver timely high-performance and cost effective solutions.

Insight SiP key benefits:
‐    Fast time to market
‐    Lowest cost and size for each SiP project
‐    Address multiple technologies: LTCC, Laminate, IPD, PCB
‐    Production ready designs
‐    Close relationships with key manufacturing partners
‐    Design flow optimized for co-design with semiconductor companies