Insight SiP serves the market with turn-key design services and creative packaging solutions to customers who need highly integrated systems to meet wireless and portable devices space requirements. IT’S ALL IN THE PACKAGE! IN SHORTER TIME!

Phone: +33 (0) 493 008 880

GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Bluetooth Low Energy V4.2 Compliant - ISP130301 High Performance Module

High Performance Bluetooth & ANT+ Low Energy Module with MCU & Antenna


Applications | Certification | Block Diagram | Main Specifications | Product User Guide

Insight SIP’s popular 130301 BLE Module offers for many customers the perfect balance of power and performance at a competitive price for their Bluetooth Low Energy Applications. Based on Nordic Semiconductor’s market-leading nRF51 chip, it is one of the smallest BLE / Bluetooth Smart modules on the market, at a size of only 8x 11 x 1.2 mm. With an integrated M0 processor, it can run as an autonomous Bluetooth node, connected to sensors via the analog/digital interfaces, or it can connect to external microprocessors via various bus interfaces as part of a more complex system.

Power consumption is excellent, and with integrated crystals and DC-DC converter, this Bluetooth Smart Module maximises the energy-saving features of the Nordic chipset.

Offering tiny size, a large flash and SRAM capacity, and low power consumption, this Bluetooth V4.2 Compliant Low Energy module offers the ideal choice for customers wanting to balance cost and sophistication.

Applications

  • Connected sensors for medical devices, healthcare, sport, fitness, industrial …
  • IoT applications, connected objects
  • Wearable technology
  • Home automation
  • Beacons

Certification

  • Bluetooth SIG certified QDL listing
  • Fully CE certified module
  • Fully FCC certified module
  • Fully IC certified module
  • Fully IMOC certified module
  • Fully TELEC certified module
  • RoHS compliant

Block Diagram

This module is based on nRF51 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC). It can support Bluetooth® Low Energy, 2.4GHz proprietary ultra low-power wireless protocols and optional ANT/ANT+ protocol. Related stacks are provided with SoftDevice S100 series for Central, Peripheral or both roles for BLE. The nRF51 platform also offers extensive software support for ANT applications with S210 SoftDevices and dual ANT/BLE stack S310 SoftDevices.

Main Specifications

  • Single Mode BLE V4.2 Compliant
  • Based on Nordic Semiconductor nRF51
  • 2.4GHz low energy RF Transceiver
  • ANT+ protocol in option
  • IPv6 Connectivity
  • ECDH Encryption
  • 32bit ARM Cortex M0 CPU
  • 256 kB Flash, 16 kB or 32 kB SRAM
  • 30 GPIOs including 6 ADC & 2 Ref inputs
  • Very small size 8.0 x 11.0 x 1.2 mm
  • Fully integrated RF matching and Antenna
  • Integrated 16 MHz Clock
  • Integrated 32.768 kHz Synchronization
  • DC-DC loading circuit fully integrated
  • Operating Conditions
    • Supply voltage 1.8 to 3.6 V
    • Temperature range -40 to +85°C
  • Power Consumption
    • Peak current, Rx active 12.6 mA
    • Peak current, Tx active 10.5 mA
    • Deep sleep current 0.6 µA
  • Clock Sources
    • Internal HF clock, 16 MHz crystal
    • Internal LF clock, 32.768 kHz crystal
    • Frequency tolerance +/- 40 ppm
  • Radio Specification
    • Frequency range 2402-2480 MHz
    • Rx sensitivity -93 dBm
    • Antenna gain 0.6 dBi
    • Range open filed 100 m typ
    • Data rate up to 2 Mbps

Product User Guide

  • Ordering Information
    • ISP130301-BM-ZZ
      BLE, 256 kB flash, 16 kB RAM
    • ISP130301-BL-ZZ
      BLE, 256 kB flash, 32 kB RAM
    • ISP130301-AM-ZZ
      BLE & ANT protocol, 256 kB flash, 16 kB RAM
  • Prototype Packaging (ZZ = ST)
    • Delivered in unsealed standard trays or cut tapes
    • Please bake the module before assembly
  • Jedec Trays (ZZ = JT)
    • Delivered in sealed packaging
  • Tape & Reels
    • Delivered in sealed packaging
    • Multiple of 500 units (ZZ = RS)
    • Multiple of 2000 units (ZZ = R2)
  • Storage
    • Electronic sensitive devices
  • Moisture Sensitivity
    • Level MSL-5
    • Bake 24 hours at 125°C if module stored at ambient room
  • Soldering Information
    • According to Jedec J-STD-020
    • Maximum peak temperature
      260°C / 30 sec

CONTACT US

Insight SiP
GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Phone: +33 (0) 493 008 880

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