Insight SiP offers a range of services for System-in-Package components.
Type of SiPs we have designed
- Modules consisting of a substrate (laminate, ceramic, flex or leadframe), one or more die, chip-level interconnects (wire-bond or flipchip), integrated or surface-mounted passive and active components
- Stacked-die packages incorporating two or more vertically-stacked die, chip-level interconnects (wire-bond or flip-chip) on a laminate, ceramic, flex or lead-frame substrate, integrated or surface-mounted passive and active components
- Multi-Chip Modules incorporating two or more horizontally-arranged die, chip-level interconnects (wire-bond or flip-chip), and optional passive components on a laminate, ceramic, flex or lead-frame substrate
If you need
- Size reduction - SiP allows you to Integrate multiple ICs along with passives, filters, baluns, EMI shields and mechanical parts.
- Faster time to market - Faster development time than SoC. SiP implementation makes it faster to make changes to the system at the SiP level than to change the entire mask set of an SoC. SiP implementation is faster at system board level than test, tune and debug especially for RF applications.
- Lower system cost - The overall cost of the system is lower than individually packaged circuits. The integration also minimizes supply chain costs of all the individual passives surrounding the RF front-end and results in a lower total cost.
- IC technologies mix-and-match capability - Different technologies can be mixed: SiGe or GaAs for the RF part along with CMOS for the baseband part.
Different wireless technologies: WLAN, Bluetooth, GPS, WiMAX, GSM CDMA, 3G, HSPDA coming from various chip providers can be integrated in a sip to offer the customer the best combination of wireless technologies in the industry.
Then SiP is the answer
