Insight SiP serves the market with turn-key design services and creative packaging solutions to customers who need highly integrated systems to meet wireless and portable devices space requirements. IT’S ALL IN THE PACKAGE! IN SHORTER TIME!

Phone: +33 (0) 493 008 880

GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

EDAPS 2008

Date : 2008-12-10 - Seoul - Korea
Enhanced Wire Bond transition from Die to Chip carrier for 3.1-10.6 GHz UWB applications
by Olivier Fourquin - Insight SiP & Joseph Romen Cubillo, Pr Jean Gaubert, Dr Sylvain Bourdel, Marc.Battista - IM2NP
Download (1 115kb)

IMAPS 2008

Date : 2008-11-02 - Providence - USA
RF System in Package Design for Portability between Suppliers and Technology Platforms
by Chris Barratt - Insight SiP
Download (449kb)

SAME 2008

Date : 2008-10-01 - Sophia Antipolis - France
RF System in Package Design for Portability between suppliers and technology platforms
by Chris Barratt - Insight SiP
Download (374kb)

GDR SiP 2008

Date : 2008-06-04 - Paris - France
Design method for high frequency carrier to die transition in UWB SiP
by Olivier Fourquin - Insight SiP & Joseph Romen Cubillo, Pr Jean Gaubert, Dr Sylvain Bourdel, Marc Battista, Dr Nicolas Dehaese - IM2NP
Download (82kb)
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    Insight SiP
    GreenSide, Bat.7, Entree2,
    400 Avenue Roumanille, BP 309
    F-06906 Sophia–Antipolis FRANCE

    Phone: +33 (0) 493 008 880

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