Insight SiP serves the market with turn-key design services and creative packaging solutions to customers who need highly integrated systems to meet wireless and portable devices space requirements. IT’S ALL IN THE PACKAGE! IN SHORTER TIME!

Phone: +33 (0) 493 008 880

GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Whitepapers

RF SIP Portability

RF SIP Portability Today, the System-in-Package approach offers a new dimension to system integration, far beyond mere dense micro-packaging of existing System on Chip solutions. Not only does SiP offer the capability to integrate almost any kind of companion passive component with a given active circuit, but it also enables flexible combinations of analogue circuits and RF functions with digital integrated circuits. The SiP approach is a key driver for the miniaturization trend for portable devices (Cell-phones, PDAs, Ultra-miniature PCs), particularly with respect to the growing number of RF functions that need to be integrated.

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AiP Methodology

The SiP approach to RF system integration has become essential to the miniaturization of nomadic devices. Despite a long term tendency to integrate more and more functions within a single semiconductor (SoC approach) the never ending increase in functionality for small personal devices continues to drive the use of SiP to make complete systems.

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AiP Examples

The SiP approach to RF system integration has become essential to the miniaturization road-map for nomadic devices. Two different examples of AiP are presented using Insight SiP design methodology: The first example uses a multilayer ceramic substrate, whilst the second uses a 2 layer organic laminate substrate. The AiPs presented in this paper are based on systems that function in the 2.4 to 2.5 GHz ISM band.

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Bluetooth® SMART Solutions for Tiny Metal Objects Technical Trade-Off and Solutions

The rapid expansion of phone usage has opened numerous new applications in which the phone is now the central hub for communications with other objects that are part of our daily life. Bluetooth and its low energy extension Bluetooth Smart are the prevalent standards that achieve wireless communication with a range exceeding 30m. However there are some applications, with high environmental constraints, where it is extremely difficult to achieve even short range wireless connections.

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Advanced Packaging Solution for RF Systems

Today, the System-in-Package approach offers a new dimension to system integration, far beyond mere dense micro-packaging of existing System on Chip solutions. Not only does SiP offer the capability to integrate almost any kind of companion passive component with a given active circuit, but it also enables flexible combinations of analogue circuits and RF functions with digital integrated circuits. The SiP approach is a key driver for the miniaturization trend for portable devices (Smart-phones, Tablet PCs, Smart Bluetooth Devices,.. ), particularly with respect to the growing number of RF functions that need to be integrated.

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Bluetooth® SMART Low Power Sensors

Low power wireless sensing applications pose great challenges for hardware/software platform design, cost, performance, and flexibility. Depending on the sensor type, the technology, the sampling time and power supply characteristics, the platform may need to incorporate different features in order to operate in a low-power, energy-efficient manner. The Bluetooth Low Energy (BLE) standard, now called Bluetooth® SMART , is an ideal candidate for low-power wireless sensing applications. This is due to drastically reduced maximum peak current consumption and low duty cycles with synchronized connection periods.

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CONTACT US

Insight SiP
GreenSide, Bat.7, Entree2,
400 Avenue Roumanille, BP 309
F-06906 Sophia–Antipolis FRANCE

Phone: +33 (0) 493 008 880

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