Conferences
October, 2010
SAME 2010
Paper title: Ultra low power system-in-package module for Bluetooth® low energy applications
Download abstract
April 12-16, 2010
EUCAP
Technical paper title: Antenna miniaturization and integration in a 2.4 GHz system in package
Download final paper
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November 2-4, 2009
GDR Ondes
Paper title: Intégration d’antennes multicouches en module SiP Bluetooth® Download paper
October 15-16, 2009
ARCSIS Micropackaging Days
Paper title: Ultra thin RF sip design focusing on available mass market technology Download paper
September 28 – October 2, 2009
EuMW 2009
Paper title: Multi-source RF system in package design methodology Download paper
September 22-23, 2009
SAME 2009
Paper title: Antenna in package new trend in SIP design Download paper
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December 10-12, 2008
EDAPS 2008
Presentation title: Enhanced Wire Bond transition from Die to Chip carrier for 3.1-10.6 GHz UWB applications Download presentation
November 2-6, 2008
IMAPS 2008
Paper title: RF System in Package design for portability between suppliers and technology platforms
October 1-2, 2008
SAME 2008
Paper title: RF System in Package design for portability between suppliers and technology platforms Download paper
June 4-6, 2008
Colloque GDR SOC-SIP Paris
Paper title: Design method for high frequency carrier to die transitions in UWB SiP Download paper
January 28-30, 2008
2008 IEEE Systems Packaging Japan Workshop
Presentation title: Recent advances in RF SiP designs Download presentation
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October 3-4, 2007
SAME 2007 Download Pdf
June 3-8, 2007
IMS 2007 Download Pdf
May 14-15, 2007
IET & FSA International Semiconductor Forum Download Pdf
January 29–31, 2007
IEEE European Systems Packaging Workshop Download Pdf
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January 30–February 1, 2006
IEEE Systems Packaging Japan Workshop Download Pdf
SAME 2006 Download Pdf
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November 3, 2005
Colloque GDR Antennes et Circuits Download Pdf
October 5-6, 2005
SAME 2005 Download Pdf