Overview

Founded in 2005 by a group of experienced RF component and module professionals Insight SiP is a fabless RF system-in-package (SiP) company. Insight SiP provides turn-key design services and creative packaging solutions to customers who need highly integrated systems to meet wireless and portable devices space requirements. It’s all in the package.

Insight SiP expertise in RF circuit miniaturization and system in package (SiP) technology enables product development to  reach the goals of smaller size and ever increasing functionality requested by the market today.

Automation and portability in the design have been major challenges for portable device manufacturers. In order to achieve a broader standardization of the SiP approach, Insight SiP has developed unique flexible design methodologies. This methodology helps solve the issue of portability while allowing for greater integration. It shows that SiPs scale and optimize well allowing for aggressive design schedules from system definition down to fully tested layout.

Insight SiP is a research center approved by the French Ministry of Education and Research.
Under some conditions French companies using our services can get the benefit of a research tax credit (crédit d’impôt recherche - CIR).
Documentation from French Ministry of Education and Research

Core competencies

At Insight SiP our experts are fluent in all phases of the design cycle with system-in-package design knowledge combined with complete RF expertise: system design/partitioning, RF circuit design, miniaturization technology, physical layout & circuit design, system verification & multiple designs, layout check and tests.

Insight SiP has developed expertise in cellular and wireless communication systems like GSM/W-CDMA, GPS, RFID, WLAN, UWB, Bluetooth®, ISM, WHDI™ and also in antenna design and integration.

Insight SiP design engineers have a solid understanding of:
‐ Passive components (capacitors, inductor types….)
‐ Passive circuit design (filters, BALUNs, matching, power dividers,…)
‐ Active circuit design (LNA, PA, mixer, switch…)
‐ RF architecture
‐ Package types
‐ Process flows with substrate design rules
‐ And electrical properties.

Insight SiP combines this RF know how with the unique ability to embbed functions within the package irrespective of the technology:
‐ In multi-layer organic substrates (BT, FR4,..)
‐ In multi-layer ceramic substrates (LTCC, HTCC, Thick film,…)
‐ In thin film Integrated Passive Devices (IPD) on silicon or glass

They have the capabilities to evaluate architectural trade-offs, substrate technology alternatives (laminate, LTCC & IPD) and assembly related options (SMT, BGA, Wire-bond, Flip chip, Embedded die,…) to propose a set of optimized solutions to meet customer’s constraints. They have unique methods to estimate package size and performance for each of these options.

Insight SiP’s methodology is based on a user extendable library of physical objects for which the electrical models are created automatically for a given stack-up and/or technology. Thus any design that is initially made for a particular supplier can easily be re-tuned for an alternative source.

For integrated antenna design, the same methodology of combining electromagnetic simulations together with circuit level simulation and optimization is used. A portion of the antenna has a schematic representation that can be simulated and optimized at the circuit level. This process helps circumvent lengthy parametric studies and significantly shortens the design cycle and improves the performance of the entire system.

What do we provide?

With Insight SiP, it’s all in the package

‐ Custom multi-die RF system-in-package (SiP) design, antenna-in-package (AiP) design from concept to prototyping, testing up to volume production.
‐ Ready-to-use RF modules to module manufacturers and ODMs. They are the optimal solutions for designers looking to add wireless connectivity to a product without a complex and time consuming development cycle.

Applications served

Insight SiP serves the market with RF system-in-package (SiP) design and leverages its unique team of RF experts to develop solutions for wireless connectivity applications in a broad range of target markets like:
‐ Mobile Computing
‐ Portable Consumer devices
‐ Telecom
‐ Healthcare
‐ Automotive

Support

With sales, engineering, and research and development teams located in offices in Europe, US and Japan we support customers worldwide.