Company Profile
Insight SiP is a fabless design and manufacturing company that aims to provide optimal design and packaging solutions for highly integrated systems based on a System-in-Package (SiP) approach.
Insights SiP leverages its unique team expertise particularly in the RF domain to serve the market of highly integrated wireless solutions and support its client integration and miniaturization projects while respecting their design and cost objectives.
At Insight SiP, we believe in strategic partnership to constantly offer the best technologies to our customers. Thanks to our partner network of leading substrate, assembly and test companies, we help our clients go quickly and smoothly to volume production.
Insight SiP was created by a group of experienced RF component and module professionals to serve the expanding market for highly integrated solutions. The three founder members of the company, Chris Barratt, CTO, an RF SiP industry expert, Michel Beghin, CEO, and Marc Vodovar, President, have a combined experience of the RF market in excess of 75 years.
SiP
Quite often the term System-in-Package is used to describe multi-chip IC packages. The real power of SiP technology lies in its ability to integrate not only multiple ICs but also other components such as passives, connectors, antennas and so on into the package in order to create fully functional subsystems.
The IC community challenge today is not how many transistors can be built on a single chip, but how to integrate diverse circuits together predictably, reliably and cost effectively. Today's emphasis on SoC is concerned with packing different transistor technologies for different functions on a single chip. Designers hope to merge memory with logic, mixed-signal applications with digital, and integrated passive components with active circuits. Merging any of the above will compromise each of the individual technologies, and increase the complexity of the design and the manufacturing process, and thus increase the cost and have an adverse effect on performance, reliability and time-to-market.
One solution to the problem is the System-in-Package approach, using optimized technology for each function, opening natural path to modular design with concurrent engineering and ability to utilize local high technology/high density interconnect.
Our Mission
To become a leading supplier of highly integrated custom solutions for wireless communications (GSM, 3G, WiMAX, WLAN, UWB, GPS, ISM) using a System-in-Package (SiP) approach. The company has a unique combination of specific design methodology and intimate knowledge of the various technological options so as to supply optimal solutions in terms of cost, size and reliability.
